|تعداد مشاهده مقاله||2,480,971|
|تعداد دریافت فایل اصل مقاله||1,748,417|
|Journal of Electrical and Computer Engineering Innovations (JECEI)|
|مقاله 5، دوره 10، شماره 1، فروردین 2022، صفحه 47-56 اصل مقاله (1.25 M)|
|نوع مقاله: Original Research Paper|
|شناسه دیجیتال (DOI): 10.22061/jecei.2021.7750.428|
|Z. Shirmohammadi* 1؛ M. Mahmoudi2؛ M. Rostamnezhad3|
|1Department of Computer Systems Architecture, Faculty of Computer Engineering, Shahid Rajaee Teacher Training University, Tehran, Iran|
|2Department of Computer Engineering, Khajeh Nasir Toosi University of Technology, Tehran, Iran|
|3Department of Computer Engineering, Sharif University of Technology, Tehran, Iran|
|تاریخ دریافت: 11 بهمن 1399، تاریخ بازنگری: 08 فروردین 1400، تاریخ پذیرش: 21 فروردین 1400|
|Background and Objectives: Thermal problem is one of the main challenges in 3D on-chip networks. Inappropriate traffic distribution, poor heat dissipation, cooling restriction for layers away from the chip heatsink are the main reasons for this problem.|
Methods: This paper proposes a new intelligent routing algorithm called (Int-TAR) to solve these problems. Int-TAR applies a routing for managing the heat in 3D on-chip networks dynamically. The main idea behind Int-TAR is to save the past states of the system and, according to these states, predict the future behavior of the network and perform routing dynamically. It is done by the threshold of routers dynamically based on the current status of the routers.
Result: The simulation results show that Int-TAR decreases the temperature of the network by 13% and improves performance efficiently.
Conclusion: The proposed idea shows the better benchmark for the thermal problem in 3D on-chip network. Also, the higher memory for storing the past state of the network can make accurate and the further performance for the network.
|Reliability؛ Thermal؛ 3D NoC؛ Routing Algorithm|
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